Utz Technologies was founded in 1968 by Donald L. Utz and incorporated on March 10, 1971 in the State of New Jersey for the purpose of offering products and services to the hybrid electronics and circuit board industries.

The principal products and services include the manufacturing of solder printing stencils, thick-film printing screens, metal masks, computer artwork generation, and custom photoplotting. Utz Technologies thick-film screens are manufactured for the hybrid industry which uses them to print miniature electronic circuits. These highly sophisticated circuits are utilized extensively by the computer, aerospace, medical, automotive, and defense industries.

In 1983, while opening a facility in California, Utz Technologies R&D experts in Clifton, NJ collaborated with IBM and AT&T researchers to design the first Solder Printing Stencil. Early in 1984 Utz began manufacturing these stencils that are used to print solder paste on surface mounted circuit boards.

In 1987, the Utz R&D team introduced Multilevel Stencils.

The year 1991 saw Utz both introducing Laminated Stencils while adding Laser Photo Plotting to its product and service line, which required a 5,000 square foot physical expansion at the Clifton manufacturing plant.

During 1995, Laser Cut Stencils were successfully introduced to the market. This was followed in 1996 by the addition of Utz’s custom-tailored, state-of-the-art laser cutting system, another step which was taken towards enhancing the Company’s capabilities in supporting growing requirements for micro-fine miniature circuitry.